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AssigneeApplied Materials, Inc.
InventorsMuhammad M. Rasheed, Teruki Iwashita, Hiroshi Otake, Yuki Koga, Kazutoshi Maehara, Xinglong Chen, Sudhir Gondhalekar, Dmitry Lubomirsky
Estimating the term…
Embodiments of process kits for substrate supports of semiconductor substrate process chambers are provided herein. In some embodiments, a process kit for a semiconductor process chamber may include an annular body being substantially horizontal and having an inner and an outer edge, and an upper and a lower surface; an inner lip disposed proximate the inner edge and extending vertically from the upper surface; and an outer lip disposed proximate the outer edge and on the lower surface, and having a shape conforming to a surface of the substrate support pedestal. In some embodiments, a process kit for a semiconductor process chamber my include an annular body having an inner and an outer edge, and having an upper and lower surface, the upper surface disposed at a downward angle of between about 5-65 degrees in an radially outward direction from the inner edge toward the outer edge.
A process kit to cover a surface of a substrate support pedestal not covered by a substrate when the substrate is disposed on a support surface of the substrate support pedestal in a semiconductor process chamber, the process kit comprising:
An apparatus for processing a substrate, comprising:
A process kit to cover a surface of a substrate support pedestal not covered by a substrate when the substrate is disposed on a support surface of the substrate support pedestal in a semiconductor process chamber, the process kit comprising:
A process kit to cover a surface of a substrate support pedestal not covered by a substrate when the substrate is disposed on a support surface of the substrate support pedestal in a semiconductor process chamber, the process kit comprising:
Dependencies are inferred from the claim text.