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AssigneesMassachusetts Institute of Technology (Mit), Mount Holyoke College
InventorsJanice A. Hudgings, Rajeev J. Ram, Maryam Farzaneh
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In one aspect, the present invention provides techniques and apparatus for optical characterization of photonic devices and/or circuits. By way of example, the techniques can be used to identify damaged devices in photonic integrated circuits. In some embodiments, thermal imaging is employed as a diagnostic tool for characterizing the devices/circuits under investigation. For example, in one embodiment, integrated cascaded semiconductor amplifiers can be characterized using amplified spontaneous emission from one amplifier as a thermal modulation input to another amplifier. A thermoreflectance image of the second amplifier can reveal flaws, if present. Further, in some embodiments, thermal imaging in conjunction with a total energy model can be employed to characterize the elements of photonic circuits optically and/or to map the optical power distribution throughout the circuits.
A method of profiling of a photonic integrated circuit having an input port for coupling said integrated circuit to an optical fiber, comprising
A method of profiling of a photonic integrated circuit having an output port for coupling to an optical fiber for receiving output radiation from said circuit, comprising
A method of profiling of a photonic integrated circuit, comprising
Dependencies are inferred from the claim text.