Method of removing thermoset polymer from piezoelectric transducers in a print head
AssigneeXerox Corporation
InventorsBradley J. Gerner, John R. Andrews, Bryan R. Dolan, Pinyen Lin
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Abstract
A method for mounting a piezoelectric transducer layer to a diaphragm layer exposes an electrode for each piezoelectric transducer after thermoset polymer filling the interstitial space between the piezoelectric transducers has been cured. The method includes bonding a polymer layer to a diaphragm layer having a plurality of openings, bonding piezoelectric transducers to the diaphragm layer, filling areas between the piezoelectric transducers on the diaphragm layer with thermoset polymer, and removing the thermoset polymer from the piezoelectric transducers with a laser to expose a metal electrode on each piezoelectric transducer.
Claims16
A method for bonding a piezoelectric transducer layer with a diaphragm layer comprising:
- bonding a polymer layer to a diaphragm layer having a plurality of openings;
- bonding piezoelectric transducers to the diaphragm layer;
- filling areas between the piezoelectric transducers on the diaphragm layer with thermoset polymer;
- and
- removing the thermoset polymer from the piezoelectric transducers with a laser to expose a metal electrode on each piezoelectric transducer.
A method for mounting a piezoelectric transducer layer to a diaphragm layer comprising:
- bonding a polymer layer to a diaphragm layer having a plurality of openings;
- bonding piezoelectric transducers to the diaphragm layer;
- flowing thermoset polymer in areas between the piezoelectric transducers bonded to the diaphragm layer with thermoset polymer;
- curing the thermoset polymer;
- and
- ablating the cured thermoset polymer from a portion of each piezoelectric transducer with a laser to expose an electrode for each piezoelectric transducer.
Dependencies are inferred from the claim text.