Method for producing an RFID transponder product, and RFID transponder product produced using the method

An RFID transponder product comprising a non-conducting carrier layer, a non-conducting compensation layer, and a non-conducting cover layer, laminated together, with

• g. a non-intersecting coil-shaped antenna structure with a chip terminal and a bridge terminal, a connecting structure with a chip terminal and a bridge terminal, as well as a naked chip, contacting, in flip-chip technology, the chip terminals of the antenna structure and the connecting structure being arranged on the carrier layer,
• h. an embedding opening being arranged in at least one compensation layer, matching size and location of the naked chip as well as at least two contacting openings matching location of the bridge terminals,
• i. a bridge structure with two connecting terminals being arranged on the cover layer, and
• j. a carrier layer, a compensation layer, and a cover layer being arranged in reference to each other such that the naked chip is arranged in the embedding opening of the compensation layer, with the contacting openings being arranged over the bridge terminals of the antenna structure and the connecting structure, the connecting terminals being arranged over the contacting openings of the compensation layer, and the contact terminals of the bridge structure being connected to the bridge terminals of the antenna structure and the connecting structure in an electrically conducting fashion.