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US 8,408,449 B2Granted
Method of controlling bump printing apparatus
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJoon Kon Kim
Life of this patent
Estimating the term…
Abstract
A method of controlling a bump printing apparatus includes securing a board having air holes therein to a printing table by vacuum suction using suction nozzles; bringing a mask into close contact with the board; printing solder bumps by compressing and moving a solder paste across an upper surface of the mask using a squeegee; spraying air through spray nozzles to separate the mask from the board; and terminating air spraying using the spray nozzles and terminating air suction using the suction nozzles to remove the board.
Claims3
A method of controlling a bump printing apparatus, the method comprising:
- securing a board having air holes therein to a printing table by vacuum suction using suction nozzles;
- bringing a mask into contact with the board;
- printing solder bumps by compressing and moving a solder paste across an upper surface of the mask using a squeegee;
- spraying air through spray nozzles and the air holes to separate the mask from the board;
- and
- terminating air spraying using the spray nozzles and terminating air suction using the suction nozzles to remove the board.
3 more elements
Dependencies are inferred from the claim text.