US 8,408,262 B2Granted

Adaptive chuck for planar bonding between substrates

AssigneeInternational Business Machines Corporation

InventorsDechao Guo, Fei Liu, Leathen Shi, Keith Kwong Hon Wong

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Abstract

An electrostatic chuck includes an array of independently biased conductive chuck elements, an array of sensor-conductor assemblies, and/or a combination of an array of sensor-conductor assemblies and at least one motorized chuck. Conductive chuck elements, either standing alone or embedded in a sensor-conductor assembly, are independently biased electrostatically to compensate for bowing and/or warping of a substrate thereupon so that the substrate can be bonded with a planar surface. A single electrostatic chuck can be employed to reduce the bowing and warping of one of the two substrates to be bonded, or two electrostatic chucks can be employed to minimize the bowing and warping of two substrates to be bonded.

Claims20

Dependent claims

An apparatus for flattening at least one substrate, said apparatus comprising an electrostatic chuck, a plurality of electrical lead wires, and a controller, wherein said electrostatic chuck comprises:

an insulating chuck body having a planar topmost surface and configured to hold a substrate;
and
an array of sensor-conductor assemblies including independently electrically biased conductive chuck elements, wherein each independently electrically biased conductive chuck element within said array is embedded in said insulating chuck body and is attached to a motor configured to vertically move said independently electrically biased conductive chuck element and is electrically insulated from one another, and wherein said controller is configured to generate a map of a distance between a top surface of said insulting chuck body and a bottom surface of said substrate at a location of each of said array of sensor-conductor assemblies by vertically moving said array of sensor-conductor assemblies until contact with said bottom surface of said substrate, and by determining a time period between initiation of said vertically moving and said contact for each of said array of sensor-conductor assemblies.

an insulating chuck body having a planar topmost surface;
and
an array of sensor-conductor assemblies embedded in said insulating chuck body and electrically insulated from one another, wherein each of said sensor-conductor assemblies includes an independently electrically biased conductive chuck element, a sensor configured to detect a substrate upon contact, and a motor that moves said sensor and said independently electrically biased conductive chuck element vertically,
and wherein said controller is configured to generate a map of a distance between a top surface of said insulting chuck body and a bottom surface of said substrate at a location of each of said array of sensor-conductor assemblies by vertically moving said array of sensor-conductor assemblies until contact with said bottom surface of said substrate and by determining a time period between initiation of said vertically moving and said contact for each of said array of sensor-conductor assemblies.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 12/575,968Filed 8 Oct 2009
Published: US 2011/0083786 A114 Apr 2011
Granted: 2 Apr 2013
Term ends: Not estimatedThe source records don’t support an estimate.

Classification7 codes

H10P 72/722
Using electrostatic chucks: details of electrostatic chucks
B32B 37/0007
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding: involving treatment or provisions in order to avoid deformation or…
B32B 2457/14
Electrical equipment: semiconductor wafers
Y10T 156/1002
Methods of surface bonding and/or assembly therefor: with permanent bending or reshaping or surface deformation of self sustaining lamina