Method of manufacting an electronic device module with integrated antenna structure

A method of fabricating an electronic device module, the method comprising:

• attaching an electronic device package to a temporary carrier structure;
• affixing an electrically conductive ground element to the temporary carrier structure, the ground element having defined therein a device opening for the electronic device package and an antenna opening;
• applying an encapsulating material overlying the temporary carrier structure, the electronic device package, and the ground element;
• thereafter removing the temporary carrier structure to expose a device mounting surface, wherein the ground element and device contacts of the electronic device package are exposed at the device mounting surface;
• and
• thereafter forming an antenna circuit structure overlying the ground element and the device contacts, the antenna circuit structure comprising a patch antenna signal element, wherein a projection of the patch antenna signal element onto the device mounting surface resides within the antenna opening.