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US 8,403,684 B2Granted
Connector having a terminal with a tin plated contact pressed against a hot-dip tinned face of a board
AssigneeMitsubishi Electric Corporation
InventorsNorikazu Tateishi, Masaru Kibi
Life of this patent
Estimating the term…
Abstract
A tin-plated surface 7 is formed by hot-dip coating a solder containing a lead-free tin as the main component on an electrode 6 of a board 4 with which a connector terminal 1 comes in contact.
Claims13
A connector connecting structure for electrically connecting a connector terminal to an electrode face of a board, comprising:
- a hot-dip tinned face formed by hot-dip coating lead-free solder containing tin as the main component on the surface of the electrode face of the board;
- and
- a moving section having resilience and provided with a tin plated contact portion in the connector terminal,
- wherein it is constructed that the contact portion is pressed against the electrode face of the board by resilience of the moving section.
1 more element
Dependencies are inferred from the claim text.