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US 8,397,371 B2Granted
Process of manufacturing low resistance damascene coils
AssigneeHGST Netherlands B.V.
InventorsDaniel Wayne Bedell, David Patrick Druist, Edward Hin Pong Lee, Jennifer Ai-Ming Loo, Vladimir Nikitin, Sue Siyang Zhang
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Abstract
In one embodiment and method of the present invention, a coil of a write head is created by forming a P1 pedestal layer and a back gap layer and further forming a coil pattern consistent with the coil to be formed and insulator spacers dispersed in the coil pattern, using a non-damascene process, thereafter the coil is formed by plating using a damascene process.
Claims13
A method of forming a coil of a write head comprising:
- forming a P1 pedestal layer;
- forming a back gap layer;
- forming insulator spacers using a non-damascene process by forming a photoresist;
- removing the photoresist, by dry resist processing to form the insulator spacers between the P1 pedestal layer and the back gap layer;
- depositing a seed layer on top and sides of the P1 pedestal layer and the back gap layer and between top and sides of the insulator spacers;
- and
- forming a coil having coil turns disposed between the insulator spacers using a damascene process.
4 more elements
Dependencies are inferred from the claim text.