Substrate-penetrating electrical connections

Method for manufacturing of an electrical via through a substrate, said method comprising the steps of:

• providing a substrate comprising a wafer or a stack of wafers;
• creating a hole penetrating at least a part of said substrate;
• making a surface of said substrate confining said hole electrically insulating;
• creating an electrical connection, in low-resistance silicon separately from said substrate and entirely outside said hole, said electrical connection being created with a protrusion;
• and inserting, after the step of providing the electrical connection is fully completed, said electrical connection, having said protrusion/into said hole said step of inserting comprising arranging said protrusion to protrude transversal to a main extension of said hole with said protrusion protruding outside a minimum hole diameter as projected in said main extension of said hole.

A method for manufacturing of an electrical via through a substrate, said method comprising the steps of:

• providing a substrate comprising a wafer;
• creating a hole penetrating through the substrate with a surface of the substrate confining the created hole, the hole having a main extension, the hole having a minimum first hole diameter at a first location and a second hole diameter at a second location defining a recess part of the hole, the second hole diameter being larger than the minimum first hole diameter;
• oxidizing the surface of the substrate confining the hole electrically to make interior surfaces defining the hole electrically insulating;
• providing an electrical connection of low-resistance silicon, the electrical connection having a protrusion, the electrical connection, including the protrusion, being provided entirely outside of the substrate and entirely outside the hole of the substrate;
• and after said providing the electrical connection step is fully completed, mechanically mounting the electrical connection into the hole, said mounting step including arranging the protrusion to protrude i) transversal to the main extension of the hole and ii) be located at the second location having the second hole diameter projecting in the main extension of the hole, wherein after said mounting step, the electrical connection defines an electrical via, and wherein the electrical connection is a material different from a material of the substrate.