Composite woven fabric and printed wiring board
AssigneeShin-Etsu Quartz Products Co., Ltd.
InventorsAkira Sato, Akira Fujinoki, Hiroyuki Nishimura, Tsukasa Sakaguchi
Life of this patent
Estimating the term…
Loading patent…
AssigneeShin-Etsu Quartz Products Co., Ltd.
InventorsAkira Sato, Akira Fujinoki, Hiroyuki Nishimura, Tsukasa Sakaguchi
Estimating the term…
Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.
A composite woven fabric, comprising:
A composite woven fabric, comprising:
A composite woven fabric, comprising:
A printed wiring board produced by using the composite woven fabric comprising:
Dependencies are inferred from the claim text.