Electrostatic chuck assembly
AssigneeApplied Materials, Inc.
InventorsSteven V. Sansoni, Cheng-Hsiung Tsai, Shambhu N. Roy, Karl M. Brown, Vijay D. Parkhe, Hari Ponnekanti
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Abstract
Embodiments of the present invention provide a cost effective electrostatic chuck assembly capable of operating over a wide temperature range in an ultra-high vacuum environment while minimizing thermo-mechanical stresses within the electrostatic chuck assembly. In one embodiment, the electrostatic chuck assembly includes a dielectric body having chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectric body.
Claims8
An electrostatic chuck assembly, comprising:
- a support housing;
- a puck comprising:
- an electrically insulative upper puck plate having one or more chucking electrodes and one or more heating elements;
- a lower puck plate bonded to the upper puck plate within a bonding region comprising a raised portion;
- and
- a gap separating the upper puck plate from the lower puck plate outside the bonding region;
- one or more o-rings disposed between the lower puck plate and support housing;
- and
- a cooling plate comprising one or more cooling channels and disposed between the bonding region and the one or more o-rings, said cooling plate coupled to and in thermal communication with the lower puck plate.
Dependencies are inferred from the claim text.