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US 8,384,121 B2Granted
Electronic devices with yielding substrates
AssigneeCooledge Lighting Inc.
InventorsMichael Tischler, Philippe Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
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Abstract
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Claims26
An electronic device comprising:
- an unpackaged inorganic light-emitting diode (LED) die having first and second distinct non-coplanar contacts on a first surface thereof;
- and
- a flexible substrate having first and second conductive traces on a first surface thereof, the first and second conductive traces being separated on the substrate by a gap therebetween,
- wherein the first and second contacts are adhered to and in electrical contact with, respectively, the first and second conductive traces with a pressure-activated adhesive material notwithstanding the non-coplanarity of the first and second contacts, and without electrically bridging the traces or the contacts.
1 more element
Dependencies are inferred from the claim text.