Method of manufacturing micro patterned device and device obtained by the method
AssigneeNanyang Technological University
InventorsChangming Li, Ling Yu
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Abstract
The present invention refers to a method of manufacturing a micro patterned device. The method can comprise or consist of applying a light curable epoxy resin to a mold to obtain a curable resin filled mold. In a further step a polymeric film or an epoxy resin-coated glass is applied over the curable resin filled mold. Subsequently, the curable resin filled mold to which the polymeric film or the epoxy resin-coated glass is applied is irradiated to cure the resin. In another aspect the present invention refers to a micro patterned device obtained by a method described herein.
Claims16
A method of manufacturing a micro patterned device, wherein the method comprises:
- providing a mold;
- applying a light curable epoxy resin to the mold to obtain a light curable epoxy resin filled mold;
- providing a polymeric film;
- coating the polymeric film on one side with a layer of the light curable epoxy resin, wherein the polymeric film is transparent to radiation by light;
- irradiating with light the layer of the light curable epoxy resin coated onto the polymeric film to cure the epoxy resin and to provide a cured epoxy resin-coated polymeric film;
- applying the cured epoxy resin-coated polymeric film with the coated-side over the light curable resin filled mold;
- and
- irradiating with light the light curable resin filled mold, to which the cured epoxy resin-coated polymeric film is applied, to cure the epoxy resin in the mold, wherein the cured epoxy resin forms the micro patterned device.
Dependencies are inferred from the claim text.