Semiconductor package
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsHung-Chin Lin, Kuo-Fu Peng, Chien-Min Chen, Ko-Wei Chien
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes at least four lead frames each having an extending portion and a connecting portion, a heat dissipation plate having a top surface and a bottom surface, at least one semiconductor chip positioned on the top surface of the heat dissipation plate. At least one conductive wire electrically connects the chip to the lead frames. An encapsulation covers the lead frames, the heat dissipation plate, the semiconductor chip, and the conductive wires, while the bottom surface of the heat dissipation plate and the extending portions of the lead frames are exposed.
Claims18
A semiconductor package, comprising:
- four lead frames, each lead frame respectively having an extending portion and a connecting portion;
- a heat dissipation plate having a top surface and a bottom surface;
- at least one semiconductor chip mounted on the top surface of the heat dissipation plate;
- at least one conductive wire electrically connecting the at least one semiconductor chip and the connecting portion of each of the lead frames;
- and
- an encapsulation covering the lead frames, the heat dissipation plate, the at least one semiconductor chip and the at least one conductive wire, wherein the bottom surface of the heat dissipation plate and the extending portion of each of the lead frames are exposed outside of the encapsulation;
- wherein the encapsulation further includes a shell and a transparent portion;
- wherein the shell further includes a first recess and a second recess;
- and
- wherein the lead frame is mounted on the bottom of the first recess and the heat dissipation plate is mounted on the bottom of the second recess.
A semiconductor package, comprising:
- four lead frames, each lead frame respectively having an extending portion and a connecting portion;
- a heat dissipation plate having a top surface and a bottom surface;
- at least one semiconductor chip mounted on the top surface of the heat dissipation plate;
- at least one conductive wire electrically connecting the at least one semiconductor chip and the connecting portion of each of the lead frames;
- and
- an encapsulation covering the lead frames, the heat dissipation plate, the at least one semiconductor chip and the at least one conductive wire, wherein the bottom surface of the heat dissipation plate and the extending portion of each of the lead frames are exposed outside of the encapsulations;
- wherein the encapsulation further includes a shell and a transparent portion;
- wherein the shell further includes a first recess and a second recess;
- and
- wherein the first recess includes a first inclined surface and the second recess includes a second inclined surface.
A LED package, comprising:
- at least one lead frame having an extending portion;
- a heat dissipation plate having a top surface and a bottom surface;
- at least one LED chip mounted on the top surface of the heat dissipation plate;
- at least one conductive wire electrically connecting the at least one LED chip and the at least one lead frame;
- an encapsulation including a transparent portion covering the at least one LED chip and the conductive wire;
- and
- a shell includes a first recess and a second recess, wherein the at least one lead frame is mounted on the bottom of the first recess and the heat dissipation plate is mounted on the bottom of the second recess.
Dependencies are inferred from the claim text.