Versatile workpiece refining
AssigneeSemCon Tech, LLC
InventorCharles J. Molnar
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AssigneeSemCon Tech, LLC
InventorCharles J. Molnar
Estimating the term…
Versatile methods of refining a first and a second layer of a workpiece are discussed. New refining methods and refining apparatus are disclosed. The new refining methods can help improve yield and appreciably change the cost of manufacture for refining of workpieces. The methods can be applied to workpieces having extremely close tolerances such as semiconductor wafers. New methods of control are also discussed. Methods use controllers, processors, computers, and processor readable memory devices are discussed. Use of stored information is to make changes in process control are discussed. Use of process models are discussed for refining. Determining a changed process control with stored information from first and second layers of a workpiece is disclosed. A changed process control can make an appreciable changes to the cost of manufacture of a workpiece.
A method of refining a first and a second layer of a workpiece, each having an effect on a cost of manufacture of the workpiece, the method comprising:
A method of refining a first and a second layer of a workpiece, each having an effect on a cost of manufacture of the workpiece, the method comprising:
A method of refining a first and a second layer of a workpiece, each having an effect on a cost of manufacture of the workpiece, the method comprising:
A method of refining a first and a second layer of a workpiece, each having an effect on a cost of manufacture of the workpiece, the method comprising:
Dependencies are inferred from the claim text.