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US 8,354,467 B2Granted
Underfill formulation and method of increasing an adhesion property of same
AssigneeIntel Corporation
InventorsLinda A. Shekhawat, Gregory S. Constable, Youzhi E. Xu, Nisha Anathakrishan
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Abstract
An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
Claims2
An underfill formulation comprising:
- an epoxy resin;
- a plurality of amphiphilic block copolymers, each one of which comprises a first block segment that is insoluble in the epoxy resin and a second block segment that is soluble in the epoxy resin;
- and
- a polar reagent acting as an adhesion promoter,
- wherein:
- the epoxy resin and the second block segments are nonpolar and the first block segments are polar;
- the first block segments form polar cores of spherical micelles in the epoxy resin;
- and
- the second block segments form nonpolar shells of the spherical micelles in the epoxy resin.
6 more elements
Dependencies are inferred from the claim text.