Advanced finishing control

A method for processing a workpiece, the method comprising:

• providing i) an at least one planarizing apparatus “A” for an at least one planarizing operation, ii) an at least one piece of workpiece fabrication machinery “B” other than the at least one planarizing apparatus “A”, iii) an at least one piece of metrology equipment, iv) an at least one processor readable memory device, v) an at least one operative computerized network connecting the at least one processor readable memory device, the at least one planarizing apparatus “A”, the at least one piece of workpiece fabrication machinery “B”, and the at least one piece of metrology equipment;
• planarizing the workpiece with the at least one planarizing apparatus;
• sensing an in situ planarizing information with an operative sensor;
• determining a change for a process control parameter using an at least one processor, the at least one operative computerized network, and a family of processing information comprising (i) an at least one yield information at least in part related to a cost of manufacture, (ii) the in situ planarizing information, (iii) an information from the at least one piece of metrology equipment at least in part related to the at least one planarizing operation, (iv) an information at least in part related to the at least one planarizing apparatus “A”, and (v) an information at least in part related to the at least one workpiece fabrication machinery “B” and at least in part related to the at least one planarizing operation;
• and
• changing the process control parameter to change a processing control with an operative controller and wherein the processing control comprises a processing control at least in part related to the at least one planarizing operation.

A method for processing a workpiece, the method comprising:

• providing i) an at least one polishing apparatus “A” for an at least one polishing operation, ii) an at least one piece of workpiece fabrication machinery “B” other than the at least one polishing apparatus “A”, iii) an at least one piece of metrology equipment, iv) an at least one processor readable memory device, v) an at least one operative computerized network connecting the at least one processor readable memory device, the at least one polishing apparatus “A”, the at least one piece of workpiece fabrication machinery “B”, and the at least one piece of metrology equipment;
• polishing the workpiece with the at least one polishing apparatus;
• sensing an in situ polishing information with an operative sensor;
• determining a change for a process control parameter using an at least one processor, the at least one operative computerized network, and a family of processing information comprising (i) an at least one yield information at least in part related to a cost of manufacture, (ii) the in situ polishing information, (iii) an information from the at least one piece of metrology equipment at least in part related to the at least one polishing operation, (iv) an information at least in part related to the at least one polishing apparatus “A”, and (v) an information at least in part related to the at least one workpiece fabrication machinery “B” and at least in part related to the at least one polishing operation;
• and
• changing the process control parameter to change a processing control with an operative controller and wherein the processing control comprises a processing control at least in part related to the at least one polishing operation.