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US 8,349,129 B2Granted
Method and apparatus for debonding a submounted substrate
AssigneeArizona Board of Regents, A Body Corporate of the State of Arizona Acting for and On Behalf of Arizona State University
InventorsRobert Blanchard, R. Steve Rednour, Douglas Loy
Life of this patent
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Abstract
The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.
Claims29
An apparatus for debonding a submounted substrate comprising:
- an X-stage;
- a vacuum operated chuck attached to the X-stage, wherein the vacuum operated chuck is capable of receiving a submounted substrate;
- a Y-stage moveably coupled to the X-stage and oriented perpendicular to the X-stage;
- and
- a debonder coupled to the Y-stage, wherein the debonder comprises two mounting blocks and a cutting edge, wherein the two mounting blocks each have a distal end attached to the Y-stage such that the X-stage is capable of moving between the two mounting blocks, wherein the two mounting blocks each have a proximal end attached to an end of the cutting edge such that the cutting edge spans the X-stage, wherein the cutting edge is adjustable in height in a Z-axis.
2 more elements
A method for debonding a submounted substrate comprising:
- mounting a submounted substrate in a vacuum operated chuck attached to an X-stage, wherein the submounted substrate comprises a rigid carrier substrate bonded to a flexible substrate, wherein the X-stage is moveably coupled to a Y-stage;
- adjusting a debonder's height in a Z-axis such that the debonder is aligned with an interface between the rigid carrier substrate and the flexible substrate, wherein the debonder is coupled to the Y-stage, wherein the debonder comprises two mounting blocks and a cutting edge, wherein the two mounting blocks each have a distal end attached to the Y-stage such that the X-stage is capable of moving between the two mounting blocks, wherein the two mounting blocks each have a proximal end attached to an end of the cutting edge such that the cutting edge spans the X stage;
- bringing an upper plate comprising a vacuum-ring into contact with the flexible substrate;
- and
- debonding the flexible substrate from the rigid carrier substrate such that the debonder cuts through the interface between the rigid carrier substrate and the flexible substrate, wherein the vacuum-ring holds onto the flexible substrate via suction as the flexible substrate is debonded from the rigid carrier.
2 more elements
Dependencies are inferred from the claim text.