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US 8,349,106 B2Granted
Adhesive tape joining method and adhesive tape joining apparatus
AssigneeNitto Denko Corporation
InventorsSaburo Miyamoto, Yukitoshi Hase, Masayuki Yamamoto
Life of this patent
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Abstract
A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.
Claims5
A method of joining an adhesive tape to an adherend, comprising:
- a detecting step;
- a removing step removing the joint in accordance with detected results;
- and
- a joining step joining the adhesive tape with the joint removed therefrom to the adherend,
- the detecting step including:
- detecting a joint in the adhesive tape directly by a detector during supplying to the adherend the adhesive tape of a long length in which adhesive tapes of a predetermined length are connected to one another;
- transmitting detection signals to a controller that are detected from initiating to terminating of detecting the joint, detecting a length of the joint by the controller, determining an allowable length of the adhesive tape capable of being joined from a joining portion to the joint in accordance with the length of the joint, a length of a transportation path determined in advance corresponding to a distance from a detecting position to a tape joining position of the adhesive tape, and a unit length of the adhesive tape joined to the adherend;
- and
- determining a removal length including the joint backward from the allowable length.
6 more elements
Dependencies are inferred from the claim text.