Electrodeposition of dielectric coatings on semiconductive substrates
AssigneePPG Industries Ohio, Inc.
InventorsKelly L. Moore, Michael J. Pawlik, Michael G. Sandala, Craig A. Wilson
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Abstract
A composition for use in electrodeposition includes a resin blend, a coalescing solvent, a catalyst, water, and a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel. Another composition for use in electrodeposition includes a surfactant blend, a low ion polyol, phenoxypropanol, a catalyst, water, a flexibilizer, and a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.
Claims8
A composition for use in electrodeposition comprising:
- a resin blend;
- a coalescing solvent;
- a catalyst;
- water;
- and
- a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.
A composition for use in electrodeposition comprising:
- a surfactant blend;
- a low ion polyol;
- phenoxypropanol;
- a catalyst;
- water;
- a flexibilizer;
- and
- a highly cross-linked microgel, wherein at least 20 percent by weight of resin solids in the composition is the highly cross-linked microgel.
Dependencies are inferred from the claim text.