US 8,327,526 B2 · Isolated active temperature regulator for vacuum packaging of a disc resonator gyroscope

Abstract

A micromachined thermal and mechanical isolator for MEMS die that may include two layers, a first layer with an active temperature regulator comprising a built-in heater and temperature sensor and a second layer having mechanical isolation beams supporting the die. The isolator may be inserted between a MEMS die of a disc resonator gyroscope (DRG) chip and the leadless chip carrier (LCC) package to isolate the die from stress and temperature gradients. Thermal and mechanical stress to the DRG can be significantly reduced in addition to mitigating temperature sensitivity of the DRG chip. The small form can drastically reduce cost and power consumption of the MEMS inertial sensor and enable new applications such as smart munitions, compact and integrated space navigation solutions, with significant potential cost savings over the existing inertial systems.

Claims28

Dependent claims

A method of producing an isolator for a MEMS die, comprising,

producing a top layer comprising a resistive heater for regulating temperature of the MEMS die;
etching a bottom layer comprising a bottom layer central region, one or more bottom layer periphery regions and a plurality of substantially radial bottom layer isolation beams, each extending from the bottom layer central region to one of the one or more bottom layer periphery regions;
bonding a lower surface of the top layer to the bottom layer;
and
bonding an upper surface of the top layer to the MEMS die;
wherein a temperature sensor is used with the resistive heater to regulate the temperature of the MEMS die.

3 more elements

Dependencies are inferred from the claim text.

Isolated active temperature regulator for vacuum packaging of a disc resonator gyroscope

Life of this patent

Isolated active temperature regulator for vacuum packaging of a disc resonator gyroscope

Life of this patent

Abstract

Claims28