# US 8,319,114 B2 · Surface mount power module dual footprint > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,319,114 B2 - Document ID: US8319114B2 - Status: Granted - Kind: B2 - Application number: 12/061,453 - Filed: 2008-04-02 - Published: 2009-10-08 - Granted: 2012-11-27 - Earliest claimed: 2008-04-02 - Assignees: Densel-Lambda Kabushiki Kaisha - Inventors: Sun-Wen Cyrus Cheng; Paulette Lemond; Carl Milton Wildrick - Web page: https://patentgrep.com/patent/US8319114B2 ## CPC - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H05K 1/141: {One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence)} - H05K 3/403: {Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K3/4092 takes precedence)} - H05K 2201/09181: Notches in edge pads - H05K 2201/09663: Divided layout, i.e. conductors divided in two or more parts - H05K 2201/099: Coating over pads, e.g. solder resist partly over pads - H05K 2201/09954: More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect. ## Claims ### Claim 1 A dual footprint mounting package for a surface mount technology (SMT) electrical component, the package comprising: in a SMT power converter module device, at least one edge pad in electrical continuity with a SMT pad, wherein the SMT pad forms an electrical connection to the SMT power converter module device when soldered to a corresponding pad on a PWB, and the edge pad provides an alternate point for forming an electrical connection between the SMT power converter module device and the PWB when soldered to a surface pad on the PWB; and at least one isolated edge pad not in electrical continuity with the SMT pad, wherein the isolated edge pad forms a mechanical connection to the PWB when soldered to a pad on the PWB. ### Claim 2 (depends on 1) The package of claim 1 wherein at least one of the edge pads comprises plating that extends to approximately the height of the edge of the package. ### Claim 3 (depends on 1) The package of claim 1 wherein at least one of the edge pads comprises plating that extends a distance that is less than the height of the edge of the package, such that the plating is below the top surface of the package. ### Claim 4 A dual footprint mounting package for a surface mount technology (SMT) electrical component, the package comprising: in a SMT power converter module device, at least one edge pad in electrical continuity with a SMT pad, wherein the SMT pad forms an electrical connection to the SMT power converter module device when soldered to a corresponding pad on a PWB, and the edge pad provides an alternate point for forming an electrical connection between the SMT power converter module device and the PWB when soldered to a surface pad on the PWB; and a solder barrier device to prevent the flow of solder between the edge pad and its respective SMT pad. ### Claim 5 (depends on 4) The package of claim 4 wherein at least one of the edge pads comprises plating that extends to approximately the height of the edge of the package. ### Claim 6 (depends on 4) The package of claim 4 wherein at least one of the edge pads comprises plating that extends a distance that is less than the height of the edge of the package, such that the plating is below the top surface of the package. ### Claim 7 A dual footprint mounting package for a surface mount technology (SMT) electrical component, the component utilizing at least one SMT pad, the package comprising: at least one edge pad in electrical continuity with the SMT pad, wherein the SMT pad forms an electrical connection to the SMT electrical component when soldered to a corresponding pad on a PWB, and the edge pad provides an alternate point for forming an electrical connection between the SMT electrical component and the PWB when soldered to a surface pad on the PWB; and at least one isolated edge pad not in electrical continuity with the SMT pad, wherein the isolated edge pad forms a mechanical connection to the PWB when soldered to a pad on the PWB. ### Claim 8 (depends on 7) The package of claim 7 wherein at least one of the edge pads comprises plating that extends to approximately the height of the edge of the package. ### Claim 9 (depends on 7) The package of claim 7 wherein at least one of the edge pads comprises plating that extends a distance that is less than the height of the edge of the package, such that the plating is below the top surface of the package. ### Claim 10 A dual footprint mounting package for a surface mount technology (SMT) electrical component, the component utilizing at least one SMT pad, the package comprising: at least one edge pad in electrical continuity with the SMT pad, wherein the SMT pad forms an electrical connection to the SMT electrical component when soldered to a corresponding pad on a PWB, and the edge pad provides an alternate point for forming an electrical connection between the SMT electrical component and the PWB when soldered to a surface pad on the PWB; and a solder barrier device to prevent the flow of solder between the edge pad and its respective SMT pad. ### Claim 11 (depends on 10) The package of claim 10 wherein at least one of the edge pads comprises plating that extends to approximately the height of the edge of the package. ### Claim 12 (depends on 10) The package of claim 10 wherein at least one of the edge pads comprises plating that extends a distance that is less than the height of the edge of the package, such that the plating is below the top surface of the package.