Pin-out designation method for package-board codesign
AssigneeNational Chiao Tung University
InventorsRen-Jie Lee, Hung-Ming Chen
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AssigneeNational Chiao Tung University
InventorsRen-Jie Lee, Hung-Ming Chen
Estimating the term…
A pin out designation method for package board codesign has steps of defining pin characteristics and requirements, generating multiple pin patterns, pin blocks construction and grouping and pin blocks floorplanning. Designers may use an EDA tool to generate multiple pin patterns and may use the pin patterns to construct multiple pin blocks, to group the pin blocks around four sides of a chip and to adjust the pin blocks into a minimized package size of the chip.
A pin out designation method for package board codesign, the method being performed by a computer and comprising:
Dependencies are inferred from the claim text.
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Interconnections or connectors in packages
Characterised by their interconnections: shapes or dispositions of interconnections
Characterised by their shape or disposition: on active surfaces of flip-chip devices, e.g. underfills
Package configurations: characterised by the relative positions of pads or connectors relative to package parts
About 4 years 3 months of term left · ends 9 Feb 2031 (estimated)
1. Field of Invention
The present invention relates to an integrated circuit chip pin-out designation method and, more particularly, to a pin-out designation method for package board codesign.
2. Description of the Related Art
FIG. 1A is a top view of a first layout example of a chip on a printed circuit board (PCB);
FIG. 1B is a top view of a second layout example of a chip on a printed circuit board (PCB);
FIG. 2 is a perspective view in partial section of a chip on a PCB;
With reference to FIGS. 1A and 1B, to understand the pin out designation method for a package board codesign in accordance with the present invention, considerations and critical constrains in designating a pin-out for a chip (10) are stated as follows.
I. Pin Out Designation by Considering Signal Integrity and Power Delivery in Package-Board Codesign
When designating a pin-out, there are several critical constraints and considerations requiring care. A discussion is provided to introduce a design of a pin pattern which can take all the constraints and considerations into account.