Process control method, data registration program, and method for manufacturing electronic device
AssigneeKabushiki Kaisha Toshiba
InventorsKazuki Tateyama, Hideki Ogawa, Satoshi Imi
Life of this patent
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Abstract
A process control method and data registration program for a surface mount line includes retrieving printing quality data, mounting quality data, and soldering pass/fail data from a primary recorder, recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder, and determining whether the solder printer and the mounter need adjustment by using the data of the components which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer.
Claims16
A process control method for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the process control method comprising:
- retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein,
- recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder;
- and
- determining whether the solder printer and the mounter need adjustment by using the data of the components, which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer,
- wherein the determining includes;
- defining an upper control bound and a lower control bound for each type of the components by using the data of the components with the soldering pass/fail data indicating conforming;
- and determining whether the solder printer needs adjustment by using the upper control bound and the lower control bound.
A data registration program for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the data registration program registering each of the data by causing a computer to execute:
- retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein,
- recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder;
- and
- determining whether the solder printer and the mounter need adjustment by using the data of the components, which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer,
- wherein the determining includes causing a computer to execute;
- defining an upper control bound and a lower control bound for each type of the components by using the data of the components with the soldering pass/fail data indicating conforming;
- and determining whether the solder printer needs adjustment by using the upper control bound and the lower control bound.
A process control method for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the process control method comprising:
- retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein,
- recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder;
- and
- determining whether the solder printer and the mounter need adjustment by using the data of the components, which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer,
- wherein the determining further includes issuing an operation instruction to adjust the solder printer in response to the determination that the solder printer needs adjustment, and issuing an operation instruction to adjust the mounter in response to the determination that the mounter needs adjustment.
A data registration program for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the data registration program registering each of the data by causing a computer to execute:
- retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein,
- recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder;
- and
- determining whether the solder printer and the mounter need adjustment by using the data of the components, which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer,
- wherein the determining further includes causing a computer to execute issuing an operation instruction to adjust the solder printer in response to the determination that the solder printer needs adjustment, and issuing an operation instruction to adjust the mounter in response to the determination that the mounter needs adjustment.
Dependencies are inferred from the claim text.