Variable directional microphone assembly and method of making the microphone assembly

A method of manufacturing a variable directional microphone assembly, the method comprising:

• preparing a substrate including printed circuit board parts for microphone-mounting connected to both sides of a rigid printed circuit board part through connections of a flexible printed circuit board;
• mounting a semiconductor integrated circuit device to a surface of the rigid printed circuit board part;
• mounting microphone devices to the printed circuit board parts for microphone-mounting;
• cutting a bridge of the substrate;
• coupling a microphone body and the substrate to each other by inserting the semiconductor integrated circuit device of the rigid printed circuit board part into a first mounting space of the microphone body;
• bending the connect ions connecting the flexible printed circuit board to the rigid printed circuit board part to respectively mount the microphone devices to second mounting spaces of the microphone body;
• and
• mounting the microphone body to a case and then curling ends of the case to complete an assembly.

A variable directional microphone assembly comprising:

• a substrate comprising a rigid circuit board having a first surface, a second surface opposite the first surface, and side surfaces connecting the first and second surfaces;
• the substrate including printed circuit board parts for microphone-mounting, wherein the printed circuit board parts are connected to opposing side surfaces of the rigid printed circuit board part through connections of a bendable flexible printed circuit board;
• a semiconductor integrated circuit device mounted on the first surface of the rigid printed circuit board part of the substrate;
• two microphone devices respectively mounted on the printed circuit board parts for microphone-mounting;
• a microphone body including a first mounting space formed within a first surface of the microphone body, and two second mounting spaces formed within a second surface of the microphone body that is opposite to and faces away from the first surface, the microphone body being positioned on the first surface of the rigid printed circuit board such that the semiconductor integrated circuit is mounted within the first mounting space, the printed circuit board parts being bent towards the two second mounting spaces such that the connections of the bendable flexible printed circuit board are bent and the two microphone devices are respectively fitted within the two second mounting spaces;
• and
• a case including a sound hole in a bottom thereof and in which the substrate and the microphone body are inserted, the sound hole corresponding to the microphone devices.