Semiconductor storage device, memory cell array, and a fabrication method and drive method of a semiconductor storage device
AssigneeNEC Corporation
InventorMasayuki Terai
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AssigneeNEC Corporation
InventorMasayuki Terai
Estimating the term…
A semiconductor storage device is provided for solving the problem of the inability to simultaneously realize high reliability and decreased cell area. A selection electrode (106) is formed to sandwich an insulating film (105) with a p-type semiconductor region (102). A first n-type semiconductor region (103) and a second n-type semiconductor region (104) are formed in the p-type semiconductor region (102) at two sides of the selection electrode (106). A first resistance-changing layer (107) is connected to the first n-type semiconductor region (103), and a second resistance-changing layer (109) is connected to the second n-type semiconductor region (104). In addition, a first wiring layer (108) is connected to the second resistance-changing layer (109), and a second wiring layer (110) is connected to the second resistance-changing layer (109).
A semiconductor storage device comprising:
A fabrication method of a semiconductor storage device, comprising:
Dependencies are inferred from the claim text.