Stackable treated via package and method
AssigneeAmkor Technology, Inc.
InventorsRobert Francis Darveaux, Ludovico Bancod, Akito Yoshida
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Abstract
A method of forming a stackable treated via package includes coupling interconnection balls to terminals. The interconnection balls are encapsulated in a package body. Via apertures are formed in the package body to expose the interconnection balls. The interconnection balls are treated to form treated interconnection balls comprising treated surfaces. The treated interconnection balls of the stackable treated via package enhance bonding with interconnection balls of a stacked electronic component package thus maximizing yield.
Claims19
A structure comprising:
- a substrate;
- a terminal coupled to the substrate;
- a treated interconnection ball coupled to the terminal;
- an electronic component coupled to the substrate;
- and
- a package body enclosing the electronic component, the package body comprising a via aperture extending through the package body to expose a treated surface of the treated interconnection ball.
A structure comprising:
- a stackable treated via package comprising:
- an electronic component;
- treated interconnection balls comprising treated surfaces;
- and
- a package body enclosing the electronic component, the package body comprising via apertures exposing the treated surfaces;
- and
- a stacked electronic component package stacked upon the stackable treated via package.
A method comprising:
- coupling an interconnection ball to a terminal coupled to a substrate;
- attaching an electronic component to the substrate;
- encapsulating the electronic component and the interconnection ball in a package body;
- forming a via aperture in the package body to expose the interconnection ball;
- and
- treating the interconnection ball to form a treated interconnection ball comprising a treated surface.
Dependencies are inferred from the claim text.