Printed circuit board equipped with piezoelectric element
AssigneeCanon Kabushiki Kaisha
InventorOsamu Nagasaki
Life of this patent
Estimating the term…
Abstract
An electronic apparatus includes, for example, a circuit board with an electronic component and a piezoelectric element, a reference potential pattern that gives a reference potential to at least one of the electronic component and the piezoelectric element, and a solder land connected to the reference potential pattern. On the circuit board, the electronic component is located on a downstream side in a transport direction of the circuit board during mounting of the piezoelectric element and the electronic component on the solder land, and the piezoelectric element is located on an upstream side in the transport direction.
Claims31
An electronic apparatus comprising:
- a circuit board with an electronic component and a piezoelectric element, the circuit board being transported so as to solder the electronic component and the piezoelectric element to the circuit board;
- a reference potential pattern that is connected to at least one of the electronic component and the piezoelectric element on the circuit board;
- and
- a solder land connected to the reference potential pattern on the circuit board,
- wherein, on the circuit board, the solder land is located between the piezoelectric element and the electronic component, and the piezoelectric element is located on an upstream side in a transport direction of the circuit board with respect to a position of the solder land.
An electronic apparatus comprising:
- a circuit board with an electronic component and a piezoelectric element;
- a reference potential pattern that is connected to at least one of the electronic component and the piezoelectric element on the circuit board;
- and
- an elongating pattern connected to the reference potential, that extends from a terminal in transport direction of the circuit board, wherein the terminal is located in the most downstream side among a plurality of terminals of the piezoelectric element while the piezoelectric element is mounted on the circuit board.
A high-voltage power supply that is installable on an image forming apparatus, comprising:
- a circuit board with an electronic component and a piezoelectric element, the circuit board being transported so as to solder the electronic component and the piezoelectric element to the circuit board;
- a reference potential pattern that is connected to at least one of the electronic component and the piezoelectric element on the circuit board;
- and
- a solder land connected to the reference potential pattern on the circuit board,
- wherein, on the circuit board, the solder land is located between the piezoelectric element and the electronic component, and the piezoelectric element is located on an upstream side in a transport direction of the circuit board with respect to a position of the solder land, and
- a high voltage that is output from the piezoelectric element is applied to a process member of the image forming apparatus.
A printed circuit board including an electronic component and a piezoelectric element, the printed circuit board being transported so as to solder the electronic component and the piezoelectric element to the circuit board, the printed circuit board comprising:
- a reference potential pattern that is connected to at least one of the electronic component and the piezoelectric element on a circuit board;
- and
- a solder land connected to the reference potential pattern on the circuit board,
- wherein, on the circuit board, the solder land is located between the piezoelectric element and the electronic component, and the piezoelectric element is located on an upstream side in a transport direction of the circuit board with respect to a position of the solder land.
A printed circuit board comprising:
- an electronic component;
- a piezoelectric element;
- a reference potential pattern that is connected to at least one of the electronic component and the piezoelectric element;
- and
- an elongating pattern connected to the reference potential pattern, that extends from a terminal in a transport direction of the circuit board, wherein the terminal is located on the most downstream side among a plurality of terminals of the piezoelectric element while the piezoelectric element is mounted on the circuit board.
A electronic apparatus comprising:
- a circuit board with an electronic component and a piezoelectric element;
- a reference potential pattern that is connected to at least one of the electronic component and the piezoelectric element on the circuit board;
- and
- a solder land connected to the reference potential pattern on the circuit board,
- wherein the solder land is located between the electronic component and the piezoelectric element.
A printed circuit board comprising:
- an electronic component;
- a piezoelectric element;
- a reference potential pattern that is connected to at least one of the electronic component and the piezoelectric element on the circuit board;
- and
- a solder land connected to the reference potential pattern on the circuit board,
- wherein the solder land is located between the electronic component and the piezoelectric element.
A high-voltage power supply that is installable on an image forming apparatus, comprising:
- a circuit board with an electronic component and a piezoelectric element;
- a reference potential pattern that is connected to at least one of the electronic component and the piezoelectric element on the circuit board;
- and
- a solder land connected to the reference potential pattern on the circuit board,
- wherein the solder land is located between the electronic component and the piezoelectric element.
A method of soldering an electronic component and a piezoelectric element on a printed circuit board, the method comprising the steps of
- mounting the electronic component and the piezoelectric element on the printed circuit board having a reference potential pattern and a solder land connected to the reference potential pattern, such that the solder land is located between the electronic component and the piezoelectric element, and
- soldering the electronic component and the piezoelectric element on the printed circuit board by transporting to a solder jet flow the printed circuit board on which the electronic component and the piezoelectric element is mounted.
Dependencies are inferred from the claim text.