Circuit substrate for mounting electronic component and circuit substrate assembly having same

A circuit substrate assembly, comprising:

• a first insulating layer defining a through hole therein;
• an electronic component accommodated in the through hole of the first insulating layer, the electronic component comprising a plurality of electrical terminals;
• a first electrically conductive layer comprising a plurality of signal-transmitting electrical traces configured for transmitting electrical signals and a plurality of electrical contacts for electrically communicating with the electronic component, the electrical contacts spatially corresponding to the through hole;
• and
• a composite layer positioned between the first electrically conductive layer and the first insulating layer, the electrically conductive layer being entirely located on one side of the composite layer, the composite layer comprising a polymer matrix and a plurality of carbon nanotube bundles embedded within the polymer matrix, the polymer matrix including a first surface being in contact with the first electrically conductive layer and an opposite second surface being in contact with the first insulating layer, the carbon nanotube bundles extending from the first surface to the second surface at an angle of from 80° to 100° relative to the first surface and being exposed at the first and second surfaces, at least a portion of the carbon nanotube bundles being in contact with the electrical terminals and the electrical contacts, and each of the electrical terminals electrically communicating with a corresponding electrical contact by at least one carbon nanotube bundle.

A circuit substrate assembly, comprising:

• an insulating layer defining a through hole therein;
• an electronic component accommodated in the through hole of the first insulating layer, the electronic component comprising a plurality of electrical terminals;
• an electrically conductive layer comprising a plurality of signal-transmitting electrical traces configured for transmitting electrical signals and a plurality of electrical contacts for electrically communicating with the electronic component, the electrical contacts spatially corresponding to the through hole;
• and
• a composite layer positioned between the electrically conductive layer and the first insulating layer, the electrically conductive layer being entirely located on one side of the composite layer, the composite layer comprising a polymer matrix and a plurality of carbon nanotube bundles embedded within the polymer matrix, the polymer matrix including a first surface being in contact with the electrically conductive layer and a second surface being in contact with the first insulating layer, the carbon nanotube bundles extending from the first surface to the second surface at an angle of from 80° to 100° relative to the first surface and being exposed at the first and second surfaces, each of the carbon nanotube bundles being isolated from other carbon nanotube bundles by the polymer matrix, each of the carbon nanotube bundles having an end being in contact with one electrical contact and another end being in contact with a corresponding electrical terminal so as to electrically connect the electrically conductive layer and the electronic component.