Computer system and heat sink
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsYao-Ting Chang, Meng-Hsien Lin
Life of this patent
Estimating the term…
Abstract
A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.
Claims12
A computer system comprising:
- an enclosure having an air intake;
- and
- a heat sink, wherein the heat sink comprises a first heat dissipating portion, a second heat dissipating portion and a third heat dissipating portion connecting the first heat dissipating portion and the second heat dissipating portion, each of the first heat dissipating portion, second heat dissipating portion and third heat dissipating portion comprising a plurality of fins and a plurality of passages formed between each two adjacent fins, the first heat dissipating portion being adjacent to the air intake, the passages of the first heat dissipating portion facing towards the air intake, the first heat dissipating portion being opposite to the second heat dissipating portion, a space being maintained between the first heat dissipating portion and the second heat dissipating portion;
- and
- an electronic element arranged between the first and second heat dissipating portions in the space.
A heat sink comprising a first heat dissipating portion, a second heat dissipating portion and a third heat dissipating portion connecting the first heat dissipating portion and the second heat dissipating portion, wherein each of the first heat dissipating portion, second heat dissipating portion and third heat dissipating portion comprises a plurality of fins and a plurality of passages maintained between each two adjacent fins, the first heat dissipating portion is opposite to the second heat dissipating portion, and a space is maintained between the first heat dissipating portion and the second heat dissipating portion and configured for mounting an electronic element therein.
Dependencies are inferred from the claim text.