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US 8,300,301 B2Granted
Method of manufacturing substrate and display apparatus having the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJung-Hun Noh, DaeJin Park, SonUk Lee
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Abstract
A method of manufacturing a substrate includes; disposing a preliminary planarization layer on a first surface of a plastic substrate, bonding a second surface of the plastic substrate onto a carrier substrate, wherein the second surface of the plastic surface is substantially opposite to the first surface, curing the preliminary planarization layer to form a planarization layer, and separating the carrier substrate from the plastic substrate.
Claims19
A method of manufacturing a substrate, the method comprising:
- disposing a preliminary planarization layer on a first surface of a plastic substrate;
- bonding a second surface of the plastic substrate onto a carrier substrate, wherein the second surface of the plastic substrate is substantially opposite to the first surface;
- curing the preliminary planarization layer to form a planarization layer;
- and
- separating the carrier substrate from the plastic substrate,
- wherein the planarization layer comprises a first protruding portion disposed corresponding to a shape of a foreign substance and aligned with a position at which the foreign substance is covered when the foreign substance is located on the plastic substrate,
- wherein the first protruding portion has a height of about 1,000 angstroms or less and a width of about 1.2 millimeters or less, and
- wherein the first protruding portion comprises second protruding portions arranged on a surface of the first protruding portion, and the second protruding portions have a maximum height of about 80 nanometers measured from a flat surface of the planarization layer and have an average width of about 5 nanometers or less.
5 more elements
A display apparatus comprising:
- a first substrate including a pixel, the first substrate comprising:
- a first base substrate;
- and
- a first planarization layer including a single layer with a thickness of about 10 micrometers to about 50 micrometers arranged between the first base substrate and the pixel, wherein the first planarization layer planarizes a surface of the first base substrate;
- and
- a second substrate facing the first substrate,
- wherein the first planarization layer comprises a first protruding portion disposed corresponding to a shape of a foreign substance and aligned with a position at which the foreign substance is covered when the foreign substance is located on the first base substrate,
- wherein the first protruding portion has a height of about 1,000 angstroms or less and a width of about 1.2 millimeters or less, and
- wherein the first protruding portion comprises second protruding portions arranged on a surface of the first protruding portion, and the second protruding portions have a maximum height of about 80 nanometers measured from a flat surface of the first planarization layer and have an average width of about 5 nanometers or less.
6 more elements
Dependencies are inferred from the claim text.