Image sensor module and camera module package having the same

An image sensor module comprising:

• an image sensor including:
• a pixel region picking up an image from light incident from the outside;
• and
• a signal processing region having bumps formed in the outer portion of the image sensor so as to process an electrical signal with respect to the image picked up by the pixel region;
• and
• a board attached to the image sensor by a liquid adhesive and provided with a window such that the pixel region of the image sensor receives light, the board including:
• a first dummy pattern formed on at least a portion around the window corresponding to a portion in which a start point and an end point of a dispensing of the liquid adhesive overlap;
• a circuit pattern formed on a same surface of the board as the first dummy pattern and in a position spaced a predetermined distance outward from the first dummy pattern such that the first dummy pattern is positioned between the window and the circuit pattern;
• and
• board-side pads electrically connected to the circuit pattern so as to come in contact with the bumps formed in the image sensor.