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US 8,299,925 B2Granted
RFID tag and manufacturing method thereof
AssigneeFujitsu Limited
InventorsHiroshi Kobayashi, Kenji Kobae
Life of this patent
Estimating the term…
Abstract
The RFID tag has a base sheet having a recess, a first element provided on the base sheet astride the recess, a second element which is provided between the first element and the base sheet and which is electrically connected to the first element, and a communication antenna which is provided on the base sheet and which is connected to at least any of the first element and the second element.
Claims2
A manufacturing method of an RFID tag comprising:
- forming a conductive pattern and a communication antenna on a surface of a heat-softening base sheet;
- mounting a second semiconductor element on the conductive pattern, with a thermosetting adhesive sandwiched therebetween;
- heating the heat-softening base sheet mounted with the second semiconductor element, to harden the thermosetting adhesive and to form, by the heating to harden the thermosetting adhesive, a recess having a greater dimension than the second semiconductor element in a portion of the base sheet where the second semiconductor element is mounted;
- mounting a first semiconductor element having a greater dimension than the recess astride the recess of the base sheet;
- connecting the first semiconductor element to the conductive pattern;
- and
- connecting at least any of the first semiconductor element and the second semiconductor element to the communication antenna on the base sheet.
4 more elements
Dependencies are inferred from the claim text.