Millimeter wave transmission line for slow phase velocity

A method of operating a metallic transmission line structure, said method comprising:

• providing a metal transmission line structure including:
• at least one first dielectric material layer located on a substrate;
• a grounding metal plane located on a top surface of said at least one first dielectric material layer and vertically separated from said substrate;
• at least one second dielectric material layer located on a top surface of said grounding metal plane;
• and
• a metallic transmission line embedded in said at least one second dielectric material layer and including first transmission line portions having a first width and second transmission line portions having a second width, wherein said first width and said second width are different, and wherein said first transmission line portions and said second transmission line portions are alternately interlaced;
• and
• an array of metallic fins located above said substrate, wherein metallic fins in said array underlie or overlie said second transmission line portions and do not underlie or overlie said first transmission line portions;
• electrically grounding said grounding metal plane;
• and
• applying a radio frequency (RF) signal across a first end of said metallic transmission line and said grounding metal plane.

A non-transitory machine readable medium embodying a design structure representing a design for a semiconductor chip, said design structure comprising:

• a first data representing a substrate;
• a second data representing at least one first dielectric material layer located on said substrate;
• a third data representing a grounding metal plane located on a top surface of said at least one first dielectric material layer and vertically separated from said substrate;
• a fourth data representing at least one second dielectric material layer located on a top surface of said grounding metal plane;
• and
• a fifth data representing a metallic transmission line embedded in said at least one second dielectric material layer and including a sixth data representing first transmission line portions having a first width and a seventh data representing second transmission line portions having a second width, wherein said first width and said second width are different, and wherein said first transmission line portions and said second transmission line portions are alternately interlaced;
• and
• an eighth data representing an array of metallic fins located above said substrate, wherein metallic fins in said array underlie or overlie said second transmission line portions and do not underlie or overlie said first transmission line portions.