Light emitting device package and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung Ki Lee, Seog Moon Choi, Hyung Jin Jeon, Sang Hyun Shin
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Abstract
The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.
Claims15
A light emitting device package comprising:
- a metal core;
- an insulating layer disposed on the metal core;
- a metal layer disposed on the insulating layer;
- a first cavity extending through parts of the metal layer and the insulating layer to expose a top surface of the metal core;
- a light emitting device directly mounted on the top surface of the metal core in the first cavity;
- and
- a second cavity extending through parts of the metal layer and the insulating layer to expose the top surface of the metal core at a position spaced apart from the first cavity by a predetermined distance,
- a conductive layer disposed on the top surface of the metal core in the second cavity, provided as a bonding material for electrically connecting the metal core to an outside circuit.
A light emitting device package comprising:
- a metal core including a first cavity composed of a lower cavity and an upper cavity;
- an insulating layer disposed on a top surface of the metal core excluding the lower cavity and including an inner surface of the upper cavity;
- a metal layer disposed on the insulating layer and including a first electrode and a second electrode electrically separated from each other;
- a light emitting device directly mounted on the metal core in the lower cavity;
- a bonding wire electrically connecting the light emitting device and the first electrode;
- and
- a second cavity extending through parts of the metal layer and the insulating layer to expose the top surface of the metal core at a position spaced apart from the first cavity by a predetermined distance,
- a conductive layer disposed on the top surface of the metal core in the second cavity, provided as a bonding metal for electrically connecting the metal core to a outside circuit.
Dependencies are inferred from the claim text.