Surface acoustic wave device and method for production of same
AssigneeKYOCERA Corporation
InventorsToru Fukano, Junya Nishii
Life of this patent
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Abstract
A method for fabricating a small and low-profile surface acoustic wave device which can be formed collectively by a wafer process without causing deterioration in characteristics is provided. The surface acoustic wave device has a piezoelectric substrate 1, an IDT 2 formed on one major surface of the piezoelectric substrate 1 and having at least one comb-shaped electrode, and a protective cover 6 forming a hollow containing space 7 with the one major surface by covering the IDT 2 above the one major surface. The protective cover 6 is provide with a through hole 15 and composed, at least partially, of a photocurable material containing an acid generator which contains fluorine.
Claims10
A surface acoustic wave device, comprising:
- a piezoelectric substrate propagating a surface acoustic wave;
- an IDT formed on one major surface of the piezoelectric substrate and comprising at least one comb-shaped electrode with a plurality of electrode fingers extending in a longitudinal direction which is perpendicular to the direction of propagation of the surface acoustic wave;
- and
- a protective cover, at least a part of which is formed of a photocurable material comprising an acid generator containing fluorine, covering a formation region of the IDT on the one major surface so as to form a hollow accommodating space with the one major surface, and comprising one or more through holes for communicating the accommodating space with outside.
Dependencies are inferred from the claim text.