Drive apparatus and semiconductor module

A drive apparatus comprising:

• an electric motor that is rotated upon supplying an electric current to the electric motor and includes:
• a motor case, which has a tubular body and a partition wall, wherein the partition wall radially inwardly extends from one end part of the tubular body;
• a stator that is placed radially inward of the tubular body and has a plurality of winding wires wound at the stator to form a plurality of phases;
• a rotor that is placed radially inward of the stator;
• a shaft that is rotatable integrally with the rotor;
• and
• at least one case side engaging portion, which is formed in the motor case;
• and
• an electronic circuit that includes at least one semiconductor module, which controls the electric current supplied to the electric motor, wherein:
• each semiconductor module includes:
• a semiconductor chip that is adapted to switch the electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one module side engaging portion that is formed in the encapsulation body and is engaged with the at least one case side engaging portion to position the semiconductor module relative to the motor case;
• the motor case includes a heat releasing portion that extends from the partition wall in a direction of a central axis of the shaft;
• each semiconductor module has a heat releasing surface, which is formed at the encapsulation body and is opposed to a chip surface of the semiconductor chip;
• and
• the heat releasing surface is engaged with the heat releasing portion by engaging the at least one module side engaging portion with the at least one case side engaging portion.

A semiconductor module adapted to be installed to an electronic circuit for driving an electric motor that includes a motor case, which has a tubular body and a partition wall radially inwardly extending from one end part of the tubular body, a stator, which is placed radially inward of the tubular body and has a plurality of winding wires wound at the stator to form a plurality of phases, a rotor, which is placed radially inward of the stator, a shaft, which is rotatable integrally with the rotor, and at least one case side engaging portion, which is formed in the motor case, the semiconductor module controlling the electric current supplied to the electric motor and comprising:

• a semiconductor chip that is adapted to switch the electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one module side engaging portion that is formed in the encapsulation body and is adapted to be engaged with the at least one case side engaging portion to position the semiconductor module relative to the motor case, wherein:
• the motor case includes a heat releasing portion that extends from the partition wall in a direction of a central axis of the shaft;
• a heat releasing surface is formed at the encapsulation body and is opposed to a chip surface of the semiconductor chip;
• and
• the heat releasing surface is adapted to be engaged with the heat releasing portion of the motor case by engaging the at least one module side engaging portion with the at least one case side engaging portion.

A drive apparatus comprising:

• an electric motor that includes:
• a motor case that is configured into a tubular form;
• a stator that is placed radially inward of the motor case and has a plurality of winding wires wound at the stator to form a plurality of phases;
• a rotor that is placed radially inward of the stator;
• and
• a shaft that is rotatable integrally with the rotor;
• and
• at least one semiconductor module, each of which includes:
• a semiconductor chip that is adapted to switch an electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one special terminal that is embedded in the encapsulation body, wherein:
• the motor case includes at least one engaging portion that corresponds to the at least one special terminal;
• the at least one special terminal projects from the encapsulation body and is engaged with the at least one engaging portion to limit a positional deviation of the semiconductor module relative to the motor case;
• the motor case includes a heat releasing portion, which projects from a wall surface of the motor case;
• the at least one semiconductor module contacts the heat releasing portion;
• the encapsulation body of each semiconductor module is configured into a generally parallelepiped form;
• six surfaces of the encapsulation body includes:
• back and front surfaces, which are opposed to each other and generally parallel to a chip surface of the semiconductor chip;
• bottom and top surfaces, which are opposed to each other and are generally perpendicular to the back and front surfaces;
• right and left lateral surfaces, which are opposed to each other and are generally perpendicular to the back and front surfaces and the bottom and top surfaces;
• the semiconductor module is positioned such that the back surface of the encapsulation body contacts the heat releasing portion;
• the at least one engaging portion includes an engaging portion that is formed in a left terminal receiving portion, which projects from the wall surface of the motor case;
• and
• the at least one special terminal includes a special terminal, which projects from the left lateral surface of the encapsulation body and is received in a groove formed in the left terminal receiving portion, so that the special terminal, which projects from the left lateral surface of the encapsulation body, is engaged with the engaging portion formed in the left terminal receiving portion.

A drive apparatus comprising:

• an electric motor that includes:
• a motor case that is configured into a tubular form;
• a stator that is placed radially inward of the motor case and has a plurality of winding wires wound at the stator to form a plurality of phases;
• a rotor that is placed radially inward of the stator;
• and
• a shaft that is rotatable integrally with the rotor;
• and
• at least one semiconductor module, each of which includes:
• a semiconductor chip that is adapted to switch an electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one special terminal that is embedded in the encapsulation body, wherein:
• the motor case includes at least one engaging portion that corresponds to the at least one special terminal;
• the at least one special terminal projects from the encapsulation body and is engaged with the at least one engaging portion to limit a positional deviation of the semiconductor module relative to the motor case;
• the motor case includes a heat releasing portion, which projects from a wall surface of the motor case;
• the at least one semiconductor module contacts the heat releasing portion;
• the encapsulation body of each semiconductor module is configured into a generally parallelepiped form;
• six surfaces of the encapsulation body includes:
• back and front surfaces, which are opposed to each other and generally parallel to a chip surface of the semiconductor chip;
• bottom and top surfaces, which are opposed to each other and are generally perpendicular to the back and front surfaces;
• right and left lateral surfaces, which are opposed to each other and are generally perpendicular to the back and front surfaces and the bottom and top surfaces;
• the semiconductor module is positioned such that the back surface of the encapsulation body contacts the heat releasing portion;
• the at least one engaging portion includes an engaging portion that is formed in a front terminal receiving portion, which projects from the wall surface of the motor case;
• and
• the at least one special terminal includes a special terminal, which projects from the front surface of the encapsulation body and is received in a groove formed in the front terminal receiving portion, so that the special terminal, which projects from the front surface of the encapsulation body, is engaged with the engaging portion formed in the front terminal receiving portion.

A drive apparatus comprising:

• an electric motor that includes:
• a motor case that is configured into a tubular form;
• a stator that is placed radially inward of the motor case and has a plurality of winding wires wound at the stator to form a plurality of phases;
• a rotor that is placed radially inward of the stator;
• and
• a shaft that is rotatable integrally with the rotor;
• and
• at least one semiconductor module, each of which includes:
• a semiconductor chip that is adapted to switch an electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one special terminal that is embedded in the encapsulation body, wherein:
• the motor case includes at least one engaging portion that corresponds to the at least one special terminal;
• the at least one special terminal projects from the encapsulation body and is engaged with the at least one engaging portion to limit a positional deviation of the semiconductor module relative to the motor case;
• the motor case includes a heat releasing portion, which projects from a wall surface of the motor case;
• the at least one semiconductor module contacts the heat releasing portion;
• the encapsulation body of each semiconductor module is configured into a generally parallelepiped form;
• six surfaces of the encapsulation body includes:
• back and front surfaces, which are opposed to each other and generally parallel to a chip surface of the semiconductor chip;
• bottom and top surfaces, which are opposed to each other and are generally perpendicular to the back and front surfaces;
• right and left lateral surfaces, which are opposed to each other and are generally perpendicular to the back and front surfaces and the bottom and top surfaces;
• the semiconductor module is positioned such that the back surface of the encapsulation body contacts the heat releasing portion;
• the at least one engaging portion includes an engaging portion that is formed in a front terminal receiving portion, which projects from the wall surface of the motor case;
• and
• the at least one special terminal includes first and second special terminals, which project from the front surface of the encapsulation body and hold the front terminal receiving portion therebetween, so that the first and second special terminals are engaged with the engaging portion formed in the front terminal receiving portion.

A drive apparatus comprising:

• an electric motor that includes:
• a motor case that is configured into a tubular form;
• a stator that is placed radially inward of the motor case and has a plurality of winding wires wound at the stator to form a plurality of phases;
• a rotor that is placed radially inward of the stator;
• and
• a shaft that is rotatable integrally with the rotor;
• and
• at least one semiconductor module, each of which includes:
• a semiconductor chip that is adapted to switch an electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one special terminal that is embedded in the encapsulation body, wherein:
• the motor case includes at least one engaging portion that corresponds to the at least one special terminal;
• the at least one special terminal projects from the encapsulation body and is engaged with the at least one engaging portion to limit a positional deviation of the semiconductor module relative to the motor case;
• the motor case includes a heat releasing portion, which projects from a wall surface of the motor case;
• the at least one semiconductor module contacts the heat releasing portion;
• the encapsulation body of each semiconductor module is configured into a generally parallelepiped form;
• six surfaces of the encapsulation body includes:
• back and front surfaces, which are opposed to each other and generally parallel to a chip surface of the semiconductor chip;
• bottom and top surfaces, which are opposed to each other and are generally perpendicular to the back and front surfaces;
• right and left lateral surfaces, which are opposed to each other and are generally perpendicular to the back and front surfaces and the bottom and top surfaces;
• the semiconductor module is positioned such that the back surface of the encapsulation body contacts the heat releasing portion;
• the at least one engaging portion includes:
• an engaging portion, which is formed in a first front terminal receiving portion that projects from the wall surface of the motor case;
• and
• an engaging portion, which is formed in a second front terminal receiving portion that projects from the wall surface of the motor case;
• the at least one special terminal includes first and second special terminals, which project from the front surface of the encapsulation body;
• and
• the first and second special terminals are placed between the first front terminal receiving portion and the second front terminal receiving portion, so that the first and second special terminals are respectively engaged with the engaging portion, which is formed in the first front terminal receiving portion, and the engaging portion, which is formed in the second front terminal receiving portion.

A drive apparatus comprising:

• an electric motor that is rotated upon supplying an electric current to the electric motor and includes:
• a motor case, which has a tubular body and a partition wall, wherein the partition wall radially inwardly extends from one end part of the tubular body;
• a stator that is placed radially inward of the tubular body and has a plurality of winding wires wound at the stator to form a plurality of phases;
• a rotor that is placed radially inward of the stator;
• a shaft that is rotatable integrally with the rotor;
• and
• at least one case side engaging portion, which is formed in the motor case;
• and
• an electronic circuit that includes at least one semiconductor module, which controls the electric current supplied to the electric motor, wherein:
• each semiconductor module includes:
• a semiconductor chip that is adapted to switch the electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one module side engaging portion that is formed in the encapsulation body and is engaged with the at least one case side engaging portion to position the semiconductor module relative to the motor case;
• the encapsulation body of each semiconductor module is configured into a generally parallelepiped form and includes:
• a front surface that is generally parallel to the chip surface of the semiconductor chip and is opposed to the heat releasing surface;
• top and bottom surfaces that are generally perpendicular to the heat releasing surface and the front surface and are opposed to each other;
• and
• right and left lateral surfaces that are generally perpendicular to the heat releasing surface, the front surface, the top surface and the bottom surface and are opposed to each other;
• the at least one module side engaging portion includes at least one grooved recess, which is recessed in the bottom surface of the encapsulation body and extends from the front surface toward the heat releasing surface of the encapsulation body.

A drive apparatus comprising:

• an electric motor that is rotated upon supplying an electric current to the electric motor and includes:
• a motor case, which has a tubular body and a partition wall, wherein the partition wall radially inwardly extends from one end part of the tubular body;
• a stator that is placed radially inward of the tubular body and has a plurality of winding wires wound at the stator to form a plurality of phases;
• a rotor that is placed radially inward of the stator;
• a shaft that is rotatable integrally with the rotor;
• and
• at least one case side engaging portion, which is formed in the motor case;
• and
• an electronic circuit that includes at least one semiconductor module, which controls the electric current supplied to the electric motor, wherein:
• each semiconductor module includes:
• a semiconductor chip that is adapted to switch the electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one module side engaging portion that is formed in the encapsulation body and is engaged with the at least one case side engaging portion to position the semiconductor module relative to the motor case;
• the encapsulation body of each semiconductor module is configured into a generally parallelepiped form and includes:
• a front surface that is generally parallel to the chip surface of the semiconductor chip and is opposed to the heat releasing surface;
• top and bottom surfaces that are generally perpendicular to the heat releasing surface and the front surface and are opposed to each other;
• and
• right and left lateral surfaces that are generally perpendicular to the heat releasing surface, the front surface, the top surface and the bottom surface and are opposed to each other;
• the at least one module side engaging portion includes at least one grooved recess, which is recessed in the front surface of the encapsulation body and extends from the bottom surface toward the top surface of the encapsulation body.

A drive apparatus comprising:

• an electric motor that is rotated upon supplying an electric current to the electric motor and includes:
• a motor case, which has a tubular body and a partition wall, wherein the partition wall radially inwardly extends from one end part of the tubular body;
• a stator that is placed radially inward of the tubular body and has a plurality of winding wires wound at the stator to form a plurality of phases;
• a rotor that is placed radially inward of the stator;
• a shaft that is rotatable integrally with the rotor;
• and
• at least one case side engaging portion, which is formed in the motor case;
• and
• an electronic circuit that includes at least one semiconductor module, which controls the electric current supplied to the electric motor, wherein:
• each semiconductor module includes:
• a semiconductor chip that is adapted to switch the electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one module side engaging portion that is formed in the encapsulation body and is engaged with the at least one case side engaging portion to position the semiconductor module relative to the motor case;
• the encapsulation body of each semiconductor module is configured into a generally parallelepiped form and includes:
• a front surface that is generally parallel to the chip surface of the semiconductor chip and is opposed to the heat releasing surface;
• top and bottom surfaces that are generally perpendicular to the heat releasing surface and the front surface and are opposed to each other;
• and
• right and left lateral surfaces that are generally perpendicular to the heat releasing surface, the front surface, the top surface and the bottom surface and are opposed to each other;
• and
• the at least one module side engaging portion includes a grooved recess, which is recessed in the front surface of the encapsulation body and extends from the left lateral surface to the right lateral surface of the encapsulation body.

A semiconductor module adapted to be installed to an electronic circuit for driving an electric motor that includes a motor case, which has a tubular body and a partition wall radially inwardly extending from one end part of the tubular body, a stator, which is placed radially inward of the tubular body and has a plurality of winding wires wound at the stator to form a plurality of phases, a rotor, which is placed radially inward of the stator, a shaft, which is rotatable integrally with the rotor, and at least one case side engaging portion, which is formed in the motor case, the semiconductor module controlling the electric current supplied to the electric motor and comprising:

• a semiconductor chip that is adapted to switch the electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one module side engaging portion that is formed in the encapsulation body and is adapted to be engaged with the at least one case side engaging portion to position the semiconductor module relative to the motor case, wherein:
• the encapsulation body is configured into a generally parallelepiped form and includes:
• a front surface that is generally parallel to the chip surface of the semiconductor chip and is opposed to the heat releasing surface;
• top and bottom surfaces that are generally perpendicular to the heat releasing surface and the front surface and are opposed to each other;
• and
• right and left lateral surfaces that are generally perpendicular to the heat releasing surface, the front surface, the top surface and the bottom surface and are opposed to each other;
• and
• the at least one module side engaging portion includes at least one grooved recess, which is recessed in the front surface of the encapsulation body and extends from the bottom surface toward the top surface of the encapsulation body.

A semiconductor module adapted to be installed to an electronic circuit for driving an electric motor that includes a motor case, which has a tubular body and a partition wall radially inwardly extending from one end part of the tubular body, a stator, which is placed radially inward of the tubular body and has a plurality of winding wires wound at the stator to form a plurality of phases, a rotor, which is placed radially inward of the stator, a shaft, which is rotatable integrally with the rotor, and at least one case side engaging portion, which is formed in the motor case, the semiconductor module controlling the electric current supplied to the electric motor and comprising:

• a semiconductor chip that is adapted to switch the electric current, which flows through each corresponding one of the plurality of winding wires;
• an encapsulation body that covers the semiconductor chip;
• and
• at least one module side engaging portion that is formed in the encapsulation body and is adapted to be engaged with the at least one case side engaging portion to position the semiconductor module relative to the motor case, wherein:
• the encapsulation body is configured into a generally parallelepiped form and includes:
• a front surface that is generally parallel to the chip surface of the semiconductor chip and is opposed to the heat releasing surface;
• top and bottom surfaces that are generally perpendicular to the heat releasing surface and the front surface and are opposed to each other;
• and
• right and left lateral surfaces that are generally perpendicular to the heat releasing surface, the front surface, the top surface and the bottom surface and are opposed to each other;
• and
• the at least one module side engaging portion includes a grooved recess, which is recessed in the front surface of the encapsulation body and extends from the left lateral surface to the right lateral surface of the encapsulation body.