Conductive ball mounting apparatus having a movable conductive ball container
AssigneeShinko Electric Industries Co., Ltd.
InventorsHideaki Sakaguchi, Kiyoaki Iida, Kazuo Tanaka
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Abstract
There is provided a method of mounting conductive balls on pads on a substrate. The method includes: (a) placing the substrate having the pads coated with an adhesive over a container for containing the conductive balls therein and whose top surface is open such that the pads faces the top surface of the container; and (b) throwing up the conductive balls in the container by moving the container up and down at a given stroke, thereby allowing the conductive balls to adhere to the adhesive coated on the pads. Step (b) is repeatedly performed.
Claims15
A conductive ball mounting apparatus for mounting conductive balls on pads on a substrate, the conductive ball mounting apparatus comprising:
- a container configured to contain the conductive balls therein, the container having an open top surface;
- a substrate holder configured to hold the substrate having the pads coated with an adhesive over the container such that the pads face the open top surface of the container;
- and
- a conductive ball throwing up apparatus for throwing up the conductive balls in the container, the conductive ball throwing up apparatus operatively engaging the container and configured to repeatedly move the container in an up and down motion at a given stroke such that conductive balls contained in the container are thrown upward from the container so as to allow the conductive balls to adhere to the adhesive coated on the pads.
Dependencies are inferred from the claim text.