Back to results
US 8,299,627 B2Granted
Semiconductor packages and electronic systems including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHye-jin Kim, Byung-seo Kim, Sun-il Youn
Life of this patent
Estimating the term…
Abstract
Provided are semiconductor packages and electronic systems including the same. A substrate is provided. A plurality of semiconductor chips may be stacked the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.
Claims16
A semiconductor package comprising:
- a substrate;
- and
- a plurality of semiconductor chips stacked on the substrate, each including at least one electrode pad, wherein at least one of the plurality of semiconductor chips includes at least one redistribution pad configured to electrically connect with the at least one electrode pad,
- wherein the at least one redistribution pad and the at least one electrode pad of the at least one of the plurality of semiconductor chips are disposed along different edges on the same surface of the at least one of the plurality of semiconductor chips, and
- wherein the plurality of semiconductor chips further comprises:
- an upper semiconductor chip stacked directly on the at least one of the plurality of semiconductor chips;
- and
- at least one electrode pad of the upper semiconductor chip is adjacent to the at least one redistribution pad.
5 more elements
A semiconductor package comprising:
- a substrate;
- and
- a plurality of semiconductor chips stacked on the substrate, each including at least one electrode pad, wherein at least one of the plurality of semiconductor chips includes at least one redistribution pad configured to electrically connect with the at least one electrode pad,
- wherein the plurality of semiconductor chips are stacked in offset directions from one another, and
- wherein the at least one redistribution pad of the at least one of the plurality of semiconductor chips is exposed, and the at least one electrode pad of the at least one of the plurality of semiconductor chips is covered with other semiconductor chips.
2 more elements
A semiconductor package comprising:
- a substrate;
- a plurality of semiconductor chips stacked on the substrate, each including at least one electrode pad, wherein at least one of the plurality of semiconductor chips includes at least one redistribution pad configured to electrically connect with the at least one electrode pad;
- and
- a plurality of bonding wires configured to connect the plurality of semiconductor chips,
- wherein at least one of the plurality of bonding wires is connected with the at least one of the plurality of semiconductor chips through the at least one redistribution pad, and
- wherein the plurality of semiconductor chips further comprises:
- an upper semiconductor chip stacked directly on the at least one of the plurality of semiconductor chips;
- and
- at least one electrode pad of the upper semiconductor chip is adjacent to the at least one redistribution pad.
6 more elements
A semiconductor package comprising:
- a substrate;
- a plurality of first semiconductor chips stacked on a first portion of the substrate, each including at least one electrode pad;
- and
- a second semiconductor chip stacked on a second portion of the substrate, the second portion being different from the first portion,
- wherein at least one of the plurality of first semiconductor chips includes at least one redistribution pad configured to electrically connect with the at least one electrode pad.
2 more elements
Dependencies are inferred from the claim text.