Semiconductor device with welded leads and method of manufacturing the same
AssigneeRenesas Electronics Corporation
InventorsTakekazu Tanaka, Kouhei Takahashi
Life of this patent
Estimating the term…
Abstract
A semiconductor device and a manufacturing method for preventing mechanical and thermal damage to the semiconductor chip. A laser beam welds a first connection pad formed on a first external lead to a first electrode formed on the surface of the semiconductor chip. A first connection hole is formed in the first connection pad, and the first connection hole overlaps the first connection electrode. A laser beam irradiates an area including the first connection hole, and the first connection pad in a portion around the first connection hole is melted to form a melting section, that is welded to the first connection electrode to easily form a semiconductor device with more excellent electrical characteristics.
Claims2
A semiconductor device comprising:
- a semiconductor chip containing a first connection electrode formed on a top surface thereof;
- and
- a first external lead including a first connection pad formed with a first connection hole,
- wherein the first connection hole overlaps the first connection electrode, and a melting section which is a melted portion of the first connection pad is welded to the first connection electrode in a portion around the first connection hole, and
- the melting point of the first connection pad is lower than that of the first connection electrode so that the first connection electrode is not melted,
- wherein the first connection electrode includes an underlayer and a melt prevention layer formed above that underlayer.
A semiconductor device comprising:
- a semiconductor chip containing a first connection electrode formed on a top surface thereof;
- and
- a first external lead including a first connection pad formed with a first connection hole,
- wherein the first connection hole overlaps the first connection electrode, and a melting section which is a melted portion of the first connection pad is welded to the first connection electrode in a portion around the first connection hole, and
- the melting point of the first connection pad is lower than that of the first connection electrode so that the first connection electrode is not melted,
- wherein the first connection pad contains a base material and a melt accelerator layer formed on a top surface of the base material.
Dependencies are inferred from the claim text.