Method for connecting two joining surfaces
AssigneeFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
InventorHermann Oppermann
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Abstract
The invention relates to a method for connecting two joining surfaces, particularly in the field of semiconductors, wherein at least one joining surface is produced by depositing a layer comprising 20 to 40% gold and 80 to 60% silver onto a substrate and selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as a joining surface. The joining surface with the nanoporous gold layer and an additional joining surface are disposed one above the other and pressed together.
Claims30
Method for connecting two joining surfaces, in particular in semiconductor technology, having the steps:
- a) producing at least one joining surface by
- depositing a layer comprising 20 to 40% gold and 60 to 80% silver onto a substrate and
- selectively removing the silver from the deposited layer in order to produce a nanoporous gold layer as joining surface,
- b) arranging the joining surface with the nanoporous gold layer and a further joining surface one above the other,
- c) pressing together the joining surfaces.
Component with two joining surfaces to be connected, in particular for semiconductor technology, in which at least one joining surface comprises a nanoporous gold layer and the joining surfaces are disposed one above the other and pressed together.
Dependencies are inferred from the claim text.