Product chips and die with a feature pattern that contains information relating to the product chip
AssigneeInternational Business Machines Corporation
InventorsJohn M. Cohn, Mark J. Flemming, John C. Malinowski, Karl V. Swanke
Life of this patent
Estimating the term…
Abstract
Product chips and die that include a pattern of features formed in a metallization level of a back-end-of-line (BEOL) wiring structure. The features in the pattern contain information relating to the die, such as a unique identifier that includes a wafer identification used to fabricate the die and a product chip location for the die on a wafer. The features may be imaged with the assistance of a beam of electromagnetic radiation that penetrates into a packaged die and is altered by the presence of the features in a way that promotes imaging.
Claims19
A structure comprising:
- a die including an active circuit region with an integrated circuit, a scribe-line channel, and a peripheral region between the active circuit region and the scribe-line channel;
- a back-end-of-line (BEOL) wiring structure with a metallization level including a plurality of conductive wires coupled with the integrated circuit;
- and
- a pattern in the peripheral region of the die, the pattern including a plurality of features in the metallization level, and the features in the pattern containing information relating to the die.
Dependencies are inferred from the claim text.