Enhanced thermal management of 3-D stacked die packaging

A method of assembling a die stack package, comprising:

• forming a stack of computing components;
• positioning a plurality of thermal plates in thermal communication with the stack;
• and
• surrounding the stack and the at least one thermal plate with a lid supported on a substrate to thereby define:
• a plurality of separate first heat transfer paths, each of which extends from one of the computing components to the lid via a corresponding one of the plurality of thermal plates and a corresponding one of a plurality of separate fins, each one of the plurality of separate fins being respectively coupled to a surface of the lid and a corresponding one of the plurality of thermal plates, and
• a second heat transfer path extending from the one of the computing components to the lid surface without passing through any thermal plate of the plurality of thermal plates.

A die stack package, comprising:

• a substrate on which underfill is disposed with electrical connections embedded therein;
• a thermal plate disposed on the underfill;
• a stack of alternating layers of adhesive and computing components disposed on the thermal plate and in electrical communication with the electrical connections;
• an additional thermal plate disposed within the stack;
• a thermal interface material (TIM) disposed on respective surfaces of the stack, the thermal plate and the additional thermal plate;
• and
• a lid adhered to the substrate to surround the thermal plate, the stack and the additional thermal plate, the lid including:
• a lid surface, which thermally communicates with the stack surface TIM to define a heat transfer path, and
• a plurality of separate fins, one of which thermally communicates with the lid surface and thermal plate surface TIM and another one of which thermally communicates with the lid surface and additional thermal plate surface TIM to define other, separate heat transfer paths extending from the lid surface to the corresponding TIM.

A die stack package, comprising:

• a substrate;
• a stack of computing components;
• a plurality of thermal plates disposed within the stack of computing components;
• a thermal interface material (TIM) disposed on respective surfaces of the stack and each thermal plate of the plurality of thermal plates;
• and
• a lid adhered to the substrate to surround the plurality of thermal plates and the stack, the lid including:
• a lid surface, which thermally communicates with the stack surface TIM to define a heat transfer path, and
• a plurality of separate fins, each one of which thermally communicates with the lid surface and thermal plate surface TIM of a corresponding one of the plurality of thermal plates to define other, separate heat transfer paths extending from the lid surface to the corresponding TIM.