Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package

A wiring substrate of a semiconductor package, comprising:

• a base film having a chip-mounted region to mount a semiconductor chip thereon;
• a wiring pattern extending from the chip-mounted region and including an input wiring electrically connected to a first input pad of the semiconductor chip and an output wiring electrically connected to an output pad of the semiconductor chip;
• and
• at least one connection line formed to be isolated from the wiring pattern within the chip-mounted region to electrically connect the first input pad of the semiconductor chip to a second input pad of the semiconductor chip spaced apart from the first input pad.

A semiconductor package, comprising:

• a base film;
• a semiconductor chip mounted on a chip-mounted region of the base film and including a first input pad to receive an input signal from the outside, a second input pad spaced apart from the first input pad, and an output pad to output an output signal;
• a wiring pattern extending from the chip-mounted region and including an input wiring electrically connected to the first input pad of the semiconductor chip and an output wiring electrically connected to the output pad of the semiconductor chip;
• and
• at least one connection line formed to be isolated from the wiring pattern within the chip-mounted region of the base film to electrically connect the first input pad of the semiconductor chip to the second input pad of the semiconductor chip.

A display device comprising:

• a semiconductor package including:
• a base film,
• a semiconductor chip mounted on a chip-mounted region of the base film, the semiconductor chip including a first input pad to receive an input signal from the outside, a second input pad spaced apart from the first input pad, and an output pad to output an output signal,
• input and output wirings extending from the chip-mounted region to be electrically connected to the semiconductor chip, and
• at least one connection line isolated from the input and output wirings within the chip-mounted region of the base film to electrically connect the first input pad of the semiconductor chip to the second input pad of the semiconductor chip;
• a printed circuit board (PCB) electrically connected to the input wiring and disposed in a first end portion of the semiconductor package;
• and
• a display panel electrically connected to the output wiring and disposed in a second end portion of the semiconductor package.

A semiconductor chip having at least one circuit element formed therein, the semiconductor chip comprising:

• a first input portion disposed on a first area of the semiconductor chip to receive an input signal from an external power source;
• a second input portion disposed on a second area of the semiconductor chip separate from the first area to receive the input signal via an external connection line from the first input portion, and to input the input signal to the at least one circuit element;
• and
• a trace line isolated between the first and second input portions such that end portions of the trace line are electrically connected to the first input portion and the second input portion, respectively, by the external connection line.