Integrated circuit package system with package stacking and method of manufacture thereof

A method of manufacture of an integrated circuit package system comprising:

• forming a base package including:
• fabricating a base package substrate having a component side and a system side including forming a component pad on the component side and a system pad on the system side,
• coupling a first integrated circuit die to the component side including forming a chip interconnect between the first integrated circuit die and the component pad,
• mounting a shield to the first integrated circuit die, and
• coupling stacking interconnects to the component side to surround the first integrated circuit die;
• forming a stacked integrated circuit package including:
• fabricating a stacked package substrate having a chip side including forming a chip side contact,
• coupling a lower stacked integrated circuit die to the chip side including coupling an upper stacked integrated circuit die to the chip side contact, and
• attaching on a coupling side, of the stacked package substrate, the stacking interconnects;
• stacking the stacked integrated circuit package on the base package in which the stacking interconnects of the stacked integrated circuit package on the stacking interconnects of the base package;
• and
• forming a stacked solder column by reflowing the stacking interconnects.

An integrated circuit package system comprising:

• a base package including:
• a base package substrate having a component side and a system side,
• a first integrated circuit die coupled to the component side,
• a shield mounted to the first integrated circuit die includes a heat spreader cap, and
• first stacking interconnects coupled to the component side to surround the first integrated circuit die;
• a stacked integrated circuit package on the base package including:
• a stacked package substrate having a chip side,
• a lower stacked integrated circuit die coupled to the chip side, and
• a coupling side, of the stacked package substrate, with second stacking interconnects mounted includes the second stacking interconnects on the first stacking interconnects of the base package;
• and
• a stacked solder column formed by reflow of the first stacking interconnects and the second stacking interconnects.