Cube semiconductor package composed of a plurality of stacked together and interconnected semiconductor chip modules

A cube semiconductor package comprising:

• a plurality semiconductor chip modules, each semiconductor chip module comprising:
• a semiconductor chip comprising:
• bonding pads disposed on a first surface;
• through-electrodes passing through the first surface and second surface opposite the first surface of the semiconductor chip;
• and
• redistribution lines disposed on at least one of the first and second surfaces, the redistribution lines being electrically coupled to the through-electrodes and to the bonding pads, wherein ends of the redistribution lines are flush with side surfaces that connect the first and second surfaces;
• and
• connection members disposed on the side surfaces that are electrically coupled to the redistribution lines, wherein
• some of the semiconductor chip modules are horizontally disposed upon each other and electrically coupled with each other via through-electrodes,
• some of the semiconductor chip modules are vertically disposed along side surfaces of the horizontally disposed semiconductor chip modules,
• wherein the vertically disposed semiconductor chip modules are electrically coupled with the horizontally disposed semiconductor chip modules via connection members which are mutually coupled to redistribution lines of the horizontally stacked semiconductor chip modules and to through-electrodes of the vertically disposed semiconductor chip modules,
• wherein some of the semiconductor chip modules have shapes and sizes that are different from the other semiconductor chip modules in which this shape and size difference results in entrapping a gap deep within the cube semiconductor package when all of the semiconductor chip modules are disposed together, and
• a gap fill member filling in the gap,
• wherein some of the through-electrodes that pass through the horizontally disposed semiconductor chip modules also pass through the gap filled member and bypass at least one of the horizontally disposed semiconductor chip modules.

A cube semiconductor package comprising:

• a plurality semiconductor chip modules, each semiconductor chip module comprising:
• a semiconductor chip comprising:
• bonding pads disposed on a first surface;
• through-electrodes passing through the first surface and second surface opposite the first surface of the semiconductor chip;
• and
• redistribution lines disposed on at least one of the first and second surfaces, the redistribution lines being electrically coupled to the through-electrodes and to the bonding pads, wherein ends of the redistribution lines are flush with side surfaces that connect the first and second surfaces;
• and
• connection members disposed on the side surfaces that are electrically coupled to the redistribution lines, wherein
• some of the semiconductor chip modules are horizontally disposed upon each other and electrically coupled with each other via through-electrodes,
• some of the semiconductor chip modules are vertically disposed along side surfaces of the horizontally disposed semiconductor chip modules,
• wherein some of the semiconductor chip modules have shapes and sizes that are different from the other semiconductor chip modules in which this shape and size difference results in entrapping a gap deep within the cube semiconductor package when all of the semiconductor chip modules are disposed together,
• a gap fill member filling in the gap,
• wherein some of the through-electrodes that pass through the horizontally disposed semiconductor chip modules also pass through the gap filled member and bypass at least one of the horizontally disposed semiconductor chip modules;
• and
• an adhesive member covering the redistribution lines and having openings defined therein for exposing the through-electrodes.