Structure and method for uniform current distribution in power supply module

A power converter system comprising:

• a QFN leadframe having a flat pad and leads connected to electrical terminals;
• a first FET chip having one power terminal attached to the pad and the opposite power terminal covered by a first metal layer connected to a first lead, the first metal layer providing a smaller resistance to a current between first lead and pad than the resistance through the first chip, thereby enabling the current to spread evenly through the first layer before entering the first chip;
• a second FET chip having one power terminal attached to the first layer and the opposite power terminal covered by a second metal layer connected to a second lead, the second metal layer providing a smaller resistance to a current from the first to the second lead, or from the pad to the second lead, than the resistance through the second chip, thereby enabling the current to spread evenly through the second layer for exiting the first chip;
• and
• bonding wires connecting the first metal layer to the first lead and the second metal layer to the second lead.