Power semiconductor device
AssigneeInfineon Technologies AG
InventorRalf Otremba
Life of this patent
Estimating the term…
Abstract
A power semiconductor device having a first active semiconductor component and a second active semiconductor component, the electrical connections of which are routed out of the semiconductor components in the form of connecting legs is disclosed. In one embodiment, the first semiconductor component is at least partially electrically connected to the second semiconductor component by means of a plug-in connection. The plug-in connection is realized by virtue of the connecting legs of the second semiconductor component engaging in the electrical connections of the first semiconductor component.
Claims16
A power semiconductor device comprising:
- a first active semiconductor component and a second active semiconductor component, the electrical connections of which are routed out of the semiconductor components in the form of connecting legs;
- and
- plug-in connections for at least partially connecting the first semiconductor component to the second semiconductor component, wherein the plug-in connections are provided by virtue of the connecting legs of the second semiconductor component engaging in the electrical connections of the first active semiconductor component,
- wherein at least one connecting leg of the second semiconductor component has a groove and at least one connecting leg of the first semiconductor component has a bore, the dimensions of the groove and of the bore being matched to one another in such a manner that, when the connecting leg of the second semiconductor component is inserted into the bore in the connecting leg of the first semiconductor component, the connecting legs latch to one another, and
- wherein in a direction perpendicular to the at least one connecting leg of the second semiconductor component, a width of the at least one connecting leg of the second semiconductor component at the groove where the connecting legs latch to one another is narrower than a width of the at least one connecting leg of the second semiconductor component at both ends of the groove.
A power semiconductor device comprising:
- a first active semiconductor component and a second active semiconductor component, the electrical connections of which are routed out of the semiconductor components in the form of connecting legs;
- plug-in connections for at least partially connecting the first semiconductor component to the second semiconductor component, wherein the plug-in connections are provided by virtue of the connecting legs of the second semiconductor component engaging in the electrical connections of the first active semiconductor component;
- and
- one or more passive semiconductor components having electrical connections to the first active semiconductor component via the plug-in connections,
- wherein the connecting legs of the second semiconductor component engage in the connecting legs of the first semiconductor component,
- wherein at least one connecting leg of the second semiconductor component has a groove and at least one connecting leg of the first semiconductor component has a bore, the dimensions of the groove and of the bore being matched to one another in such a manner that, when the connecting leg of the second semiconductor component is inserted into the bore in the connecting leg of the first semiconductor component, the connecting legs latch to one another, and
- wherein in a direction perpendicular to the at least one connecting leg of the second semiconductor component, a width of the at least one connecting leg of the second semiconductor component at the groove where the connecting legs latch to one another is narrower than a width of the at least one connecting leg of the second semiconductor component at both ends of the groove.
Dependencies are inferred from the claim text.