Substrate for semiconductor package and semiconductor package having the same

A substrate for a semiconductor package, comprising:

• a substrate body having a first face and a second face opposing the first face, wherein the substrate body comprises a semiconductor chip having a circuit unit and a bonding pad electrically connected to the through electrode;
• a through electrode passing through the substrate body between the first face and the second face;
• an insulation member disposed on the first face;
• and
• a connection member comprising:
• a first conductive unit disposed inside of the insulation member and electrically connected to the through electrode;
• and
• a second conductive unit electrically connected to the first conductive unit and directly exposed at a side face and an opposing side face of the side face of the insulation member, and
• wherein the insulation member and the substrate body are separate and distinct from each other.

A substrate for a semiconductor package, comprising:

• a substrate body having a first face and a second face opposing the first face, wherein the substrate body comprises a semiconductor chip having a circuit unit and a bonding pad electrically connected to the through electrode;
• a through electrode passing through the substrate body between the first face and the second face;
• an insulation member disposed on the first face;
• and
• a connection member comprising:
• a first conductive unit disposed inside of the insulation member and electrically connected to the through electrode;
• and
• a second conductive unit electrically connected to the first conductive unit and directly exposed at a side face and an opposing side face of the side face of the insulation member, wherein the insulation member comprises a first insulation unit and a second insulation unit disposed on the first insulation unit, the first conductive unit passes through the first insulation unit, and the second conductive unit is disposed over the first insulation unit.